Power density of various light curing units through resin inlays with modified layer thickness
홍성옥, Oh Yong-Hui, 민정범, 김진우, 이빈나, 황윤찬, 황인남, 오원만, 장훈상,
소속 상세정보
홍성옥 ( Hong Sung-Ok ) - Wonkwang University College of Dentistry and Dental Research Institute, Iksan Department of Conservative Dentistry
( Oh Yong-Hui ) - Daejin University Department of Industrial and Management Engineering
민정범 ( Min Jeong-Bum ) - Chosun University School of Dentistry Department of Conservative Dentistry
김진우 ( Kim Jin-Woo ) - Gangneung-Wonju National University College of Dentistry Department of Conservative Dentistry
이빈나 ( Lee Bin-Na ) - Chonnam National University School of Dentistry and Dental Science Research Institute Department of Conservative Dentistry
황윤찬 ( Hwang Yun-Chan ) - Chonnam National University School of Dentistry and Dental Science Research Institute Department of Conservative Dentistry
황인남 ( Hwang In-Nam ) - Chonnam National University School of Dentistry and Dental Science Research Institute Department of Conservative Dentistry
오원만 ( Oh Won-Mann ) - Chonnam National University School of Dentistry and Dental Science Research Institute Department of Conservative Dentistry
장훈상 ( Chang Hoon-Sang ) - Chonnam National University School of Dentistry and Dental Science Research Institute Department of Conservative Dentistry
KMID : 0362320120370030130
Abstract
Objectives: The purpose of this study was to enhance curing light penetration through resin inlays by modifying the thicknesses of the dentin, enamel, and translucent layers.
Materials and Methods: To investigate the layer dominantly affecting the power density of light curing units, resin wafers of each layer with 0.5 mm thickness were prepared and power density through resin wafers was measured with a dental radiometer (Cure Rite, Kerr). The dentin layer, which had the dominant effect on power density reduction, was decreased in thickness from 0.5 to 0.1 mm while thickness of the enamel layer was kept unchanged at 0.5 mm and thickness of the translucent layer was increased from 0.5 to 0.9 mm and vice versa, in order to maintain the total thickness of 1.5 mm of the resin inlay. Power density of various light curing units through resin inlays was measured.
Results: Power density measured through 0.5 mm resin wafers decreased more significantly with the dentin layer than with the enamel and translucent layers (p < 0.05). Power density through 1.5 mm resin inlays increased when the dentin layer thickness was reduced and the enamel or translucent layer thickness was increased. The highest power density was recorded with dentin layer thickness of 0.1 mm and increased translucent layer thickness in all light curing units.
Conclusions: To enhance the power density through resin inlays, reducing the dentin layer thickness and increasing the translucent layer thickness would be recommendable when fabricating resin inlays.
키워드
Dental radiometer; Layer thickness; Power density; Resin inlay
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